NSF Org:	CCF Division of Computing and Communication Foundations
Recipient:	THE LELAND STANFORD JUNIOR UNIVERSITY
Initial Amendment Date:	June 11, 1997
Latest Amendment Date:	July 9, 1999
Award Number:	9617994
Award Instrument:	Continuing Grant
Program Manager:	John Cozzens CCF  Division of Computing and Communication Foundations CSE  Directorate for Computer and Information Science and Engineering
Start Date:	June 1, 1997
End Date:	May 31, 2001 (Estimated)
Total Intended Award Amount:	$750,000.00
Total Awarded Amount to Date:	$750,000.00
Funds Obligated to Date:	FY 1997 = $500,000.00 FY 1999 = $250,000.00
History of Investigator:	Mark Cutkosky (Principal Investigator) cutkosky@stanford.edu
Recipient Sponsored Research Office:	Stanford University 450 JANE STANFORD WAY STANFORD CA  US  94305-2004 (650)723-2300
Sponsor Congressional District:	16
Primary Place of Performance:	Stanford University 450 JANE STANFORD WAY STANFORD CA  US  94305-2004
Primary Place of Performance Congressional District:	16
Unique Entity Identifier (UEI):	HJD6G4D6TJY5
Parent UEI:
NSF Program(s):	INTEGRATION ENGINEERING, DES AUTO FOR MICRO & NANO SYS
Primary Program Source:	app-0197  app-0199
Program Reference Code(s):	1463, 4730, 9148, 9159, MANU
Program Element Code(s):	146300, 471000
Award Agency Code:	4900
Fund Agency Code:	4900
Assistance Listing Number(s):	47.070

ABSTRACT

The key impediment to the widespread use of 3D layered fabrication like Shape Deposition Manufacturing (SDM) and micro-electromechanical systems (MEMS) processes is not the limitations of the processes themselves, but the ability of engineers to explore and master the expanded design space they enable. A design interface comprising an exchange format and an accompanying suite of services is proposed for these processes. This interface is based on formal representations of process-related constraints expressed in terms of three-dimensional design features with associated rules to ensure manufacturability. The interface specification will be build in collaboration with process developers at Stanford, Carnegie Mellon University and other institutions, and will build upon emerging standards for exchanging product specifications and representing manufacturing processes. In addition, the supporting communication infrastructure for exchanging design features, constraints, process capabilities and manufacturing analyses over the Internet will be developed. A series of design exercises are also proposed. The exercises will explore the ability of designers to construct libraries of re-usable elements to be scaled and miniaturized to take advantage of MEMS technology, and will explore the feasibility of integrating designs and processes from different institutions to create miniature electromechanical systems.

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