NSF Org:	ECCS Division of Electrical, Communications and Cyber Systems
Recipient:	GEORGIA TECH RESEARCH CORP
Initial Amendment Date:	August 21, 1991
Latest Amendment Date:	July 26, 1993
Award Number:	9117074
Award Instrument:	Continuing Grant
Program Manager:	george hazelrigg ECCS  Division of Electrical, Communications and Cyber Systems ENG  Directorate for Engineering
Start Date:	August 15, 1991
End Date:	January 31, 1995 (Estimated)
Total Intended Award Amount:	$583,695.00
Total Awarded Amount to Date:	$583,695.00
Funds Obligated to Date:	FY 1991 = $191,748.00 FY 1992 = $192,722.00 FY 1993 = $199,225.00
History of Investigator:	Mark Allen (Principal Investigator) mallen@seas.upenn.edu Ajeet Rohatgi (Co-Principal Investigator) Nan Jokerst (Co-Principal Investigator)
Recipient Sponsored Research Office:	Georgia Tech Research Corporation 926 DALNEY ST NW ATLANTA GA  US  30318-6395 (404)894-4819
Sponsor Congressional District:	05
Primary Place of Performance:	DATA NOT AVAILABLE
Primary Place of Performance Congressional District:
Unique Entity Identifier (UEI):	EMW9FC8J3HN4
Parent UEI:	EMW9FC8J3HN4
NSF Program(s):	EMERGING TECHNOLOGIES INITIAT, EPMD-ElectrnPhoton&MagnDevices
Primary Program Source:	app-0193
Program Reference Code(s):
Program Element Code(s):	149200, 151700
Award Agency Code:	4900
Fund Agency Code:	4900
Assistance Listing Number(s):	47.041

ABSTRACT

Research is proposed on three relatively low cost and manufacturable technologies for microelectromechanical systems (MEMS), which will contribute toward enabling commercial development of these systems. The first technology is a process for integrating optical-quality compound semiconductor materials onto silicon- based microstructures. This technology, which is based on a modification of epitaxial liftoff techniques for compound semiconductor materials, will enable the development of integrated optically- based sensors and actuators. The second technology involves the use of electroplating techniques coupled with polyimide-based electroplating forms to produce a low-cost alternative to the LIGA process for fabrication of high-aspect-ration microstructures. The third technology involves the design and fabrication of simple solar cell structures that can be used as self- contained power sources for MEMS. The solar cell structures will be optimized for the high-voltage, low-current needs of electrostatic microactuators, and designed such that they can be integrated directly with standard silicon-based microstructures.

Please report errors in award information by writing to: awardsearch@nsf.gov.