Award Abstract # 2209751
IUCRC Phase III University of Texas, Arlington: Center for Energy-Smart Electronic Systems (ES2)

NSF Org: EEC
Division of Engineering Education and Centers
Recipient: UNIVERSITY OF TEXAS AT ARLINGTON
Initial Amendment Date: August 19, 2022
Latest Amendment Date: September 16, 2024
Award Number: 2209751
Award Instrument: Continuing Grant
Program Manager: Seetha Raghavan
seraghav@nsf.gov
 (703)292-4580
EEC
 Division of Engineering Education and Centers
ENG
 Directorate for Engineering
Start Date: September 1, 2022
End Date: August 31, 2027 (Estimated)
Total Intended Award Amount: $250,000.00
Total Awarded Amount to Date: $200,000.00
Funds Obligated to Date: FY 2022 = $50,000.00
FY 2023 = $50,000.00

FY 2024 = $100,000.00
History of Investigator:
  • Dereje Agonafer (Principal Investigator)
    agonafer@uta.edu
  • Bahgat Sammakia (Co-Principal Investigator)
  • Kanad Ghose (Co-Principal Investigator)
  • Alfonso Ortega (Co-Principal Investigator)
Recipient Sponsored Research Office: University of Texas at Arlington
701 S NEDDERMAN DR
ARLINGTON
TX  US  76019-9800
(817)272-2105
Sponsor Congressional District: 25
Primary Place of Performance: University of Texas at Arlington
Mechanical & Aerospace Engineeri
Arlington
TX  US  76019-0145
Primary Place of Performance
Congressional District:
25
Unique Entity Identifier (UEI): LMLUKUPJJ9N3
Parent UEI:
NSF Program(s): IUCRC-Indust-Univ Coop Res Ctr
Primary Program Source: 01002223DB NSF RESEARCH & RELATED ACTIVIT
01002324DB NSF RESEARCH & RELATED ACTIVIT

01002425DB NSF RESEARCH & RELATED ACTIVIT

01002526DB NSF RESEARCH & RELATED ACTIVIT

01002627DB NSF RESEARCH & RELATED ACTIVIT
Program Reference Code(s): 8040, 5761, 8036, 8030
Program Element Code(s): 576100
Award Agency Code: 4900
Fund Agency Code: 4900
Assistance Listing Number(s): 47.041

ABSTRACT

With the proliferation of automation and electronic devices throughout most major industries, the amount of data being produced and the need to process/manage that data continues to grow. Automated management of data centers, addressing their emerging thermal challenges and improving their energy efficiency form the key to addressing this demand. The Center for Energy-Smart Electronic Systems (ES2), an NSF Industry University Cooperative Research Center (IUCRC), was established in 2011 to address these needs for data centers. This award provides a Phase III renewal for this 3-site IUCRC, which consists of Binghamton University, Villanova University and University of Texas at Arlington. ES2's vision is to develop systematic methodologies for operating electronic systems, including data centers, as dynamic, self- sensing and regulating systems that are predictable and verified in real time. The focus in Phase I and Phase II has been to develop new energy-optimization and thermal management models and designs, as well as tools and algorithms enabling electronic data systems to operate more efficiently and securely. Phase III will further expand on these methodologies to progress closer to a full realization of the ES2 vision. The Center brings together computer scientists, electrical engineers, and mechanical engineers in a synergistic multidisciplinary team to advance industrially relevant research in this area. ES2, in promoting significant reductions in energy consumption in electronic systems, will contribute to the national agenda of eventually reaching net-zero carbon emissions. Reducing energy costs in data centers will help to allow computing services to be more deployable and accessible for a larger population segment. ES2 continues to attract a strong group of students at the undergraduate and graduate levels and provides industrially relevant training in their careers beyond graduation.

The University of Texas at Arlington (UTA) site has grown its facilities, specifically hardware, to support ES2, often in collaboration with the Center?s industry members. Currently there is a modular data center laboratory consisting of a direct/indirect evaporative cooling unit that has been developed in collaboration with a Center partner; in Phase III this will be augmented with a second spray-based indirect evaporative cooling unit. In Phase III, there will be a considerable focus at UTA on immersion cooling, an important industry sector that is predicted to experience significant growth in the next five years. Immersion cooling applications span high-performance computing, edge computing, and cryptocurrency mining, amongst others. UTA has invested in significant infrastructure to support this important area of research, including resources for a newly renovated state-of-the-art immersion cooling lab as well as a PIV for experiments related to immersion cooling. As such, in Phase III, UTA will be conducting both experimental and computational immersion cooling research. The test laboratories also offer educational value by serving as a practical demonstration of technology and heat transfer principles for both undergraduates as well as high school students participating in UTA?s summer programs. These facilities support the educational and workforce development missions of ES2; the UTA site has a strong track record of providing highly trained STEM graduates to industry, including many of the Center?s members.

This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

PUBLICATIONS PRODUCED AS A RESULT OF THIS RESEARCH

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(Showing: 1 - 10 of 20)
Bansode, Pratik and Ramalingam, Mohan Sai and Suthar, Rohit and Bhandari, Rabin and Lakshminarayana, Akshay Boovanahally and Gupta, Gautam and Simon, Vibin Shalom and Modi, Himanshu and Nair, Vivek and Sivaraju, Krishna Bhavana and Shahi, Pardeep and Sain "Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core" , 2023 https://doi.org/10.1115/IPACK2023-111056 Citation Details
CHINTHAPARTHY, LOCHAN_SAI_REDDY and SAINI, SATYAM and SHAHI, PARDEEP and BANSODE, PRATIK_VITHOBA and MODI, HIMANSHU_GIRISHCHANDRA and AGONAFER, DEREJE "Accelerated Degradation Of Copper Cold Plates In Direct-to-Chip Liquid Cooling in Data Centers" ASHRAE journal , 2024 Citation Details
Gupta, Gautam and Nair, Vivek and Bansode, Pratik and Suthar, Rohit and Pundla, Sai Abhideep and Herring, Joseph and Lamotte-Dawaghreh, Jacob and Sivaraju, Krishna Bhavana and Agonafer, Dereje and Mynampati, Poornima and Sweeney, Mike "A Numerical Study Comparing Forced and Natural Convection in a High-Density Single-Phase Immersed Cooled Server" , 2023 https://doi.org/10.1115/IPACK2023-112065 Citation Details
Gupta, Gautam and Nair, Vivek and Pundla, Sai Abhideep and Bansode, Pratik and Suthar, Rohit and Herring, Joseph and Lamotte-Dawaghreh, Jacob and Sivaraju, Krishna Bhavana and Agonafer, Dereje and Mynampati, Poornima and Sweeney, Mike "Optimization of a Air-Cooled Heatsink for Immersion Cooling Application" , 2023 https://doi.org/10.1115/IPACK2023-112054 Citation Details
Herring, Joseph and Gupta, Gautam and Lamotte-Dawaghreh, Jacob and Bansode, Pratik and Agonafer, Dereje "Single-Phase Immersion Cooling Multi-Design Variable Heat Sink Optimization for Natural Convection" , 2023 https://doi.org/10.1115/IPACK2023-112019 Citation Details
Lamotte-Dawaghreh, Jacob and Herring, Joseph and Bhandari, Rabin and Lakshminarayana, Akshay and Suthar, Rohit and Bansode, Pratik and Agonafer, Dereje and Ramos, Nestor and Teufel, Nicolas and Silvers, Thomas and Wilson, Michael and Eifert, Dan and Marto "CHARACTERIZATION AND MODELING OF DENSITY AS A FUNCTION OF TEMPERATURE FOR PARAFFIN WAX PHASE CHANGE MATERIALS (PCMs)" Heat Transfer Research , v.55 , 2024 https://doi.org/10.1615/HeatTransRes.2023049214 Citation Details
Lamotte-Dawaghreh, Jacob and Herring, Joseph and Pundla, Sai and Suthar, Rohit and Nair, Vivek and Bansode, Pratik and Gupta, Gautam and Agonafer, Dereje and Madril, Joseph and Ouradnik, Tim and Matthews, Michael and Winfield, Ian "Electrochemical Additive Manufacturing Based Design of a Heat Sink for Single Phase Natural Convection Immersion Cooling Application" , 2023 https://doi.org/10.1115/IPACK2023-111804 Citation Details
Modi, Himanshu and Shahi, Pardeep and Simon, Vibin Shalom and Reddy Chintaparthy, Lochan Sai and Gupta, Gautam and Sivakumar, Akiilessh and Saini, Satyam and Bansode, Pratik and Agonafer, Dereje "Experimental Study of Improved Chassis and Duct Redesign for Air-Cooled Server" 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) , 2023 https://doi.org/10.1109/ITherm55368.2023.10177651 Citation Details
Saini, Satyam and Gupta, Gautam and Bansode, Pratik and Shahi, Pardeep and Simon, Vibin Shalom and Modi, Himanshu and Agonafer, Dereje and Shah, Jimil "A Numerical Study on the Influence of Mixed Convection Heat Transfer in Single-Phase Immersion Cooling" , 2023 https://doi.org/10.1115/IPACK2023-112005 Citation Details
Saini, Satyam and Wagh, Tushar and Bansode, Pratik and Shahi, Pardeep and Herring, Joseph and Lamotte-Dawaghreh, Jacob and Shah, Jimil M. and Agonafer, Dereje "A NUMERICAL STUDY ON MULTI-OBJECTIVE DESIGN OPTIMIZATION OF HEAT SINKS FOR FORCED AND NATURAL CONVECTION COOLING OF IMMERSION-COOLED SERVERS" Journal of Enhanced Heat Transfer , v.29 , 2022 https://doi.org/10.1615/JEnhHeatTransf.2022043805 Citation Details
Shahi, Pardeep and Deshmukh, Apurv and Hurnekar, Hardik Yashwant and Saini, Satyam and Bansode, Pratik and Agonafer, Dereje "NUMERICAL INVESTIGATION ON EFFECT OF TARGET COOLANT DELIVERY IN LIQUID-COOLED MICROCHANNEL HEAT SINKS" Journal of Enhanced Heat Transfer , v.30 , 2023 https://doi.org/10.1615/JEnhHeatTransf.2022044339 Citation Details
(Showing: 1 - 10 of 20)

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