
NSF Org: |
CCF Division of Computing and Communication Foundations |
Recipient: |
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Initial Amendment Date: | May 21, 2018 |
Latest Amendment Date: | June 16, 2020 |
Award Number: | 1816361 |
Award Instrument: | Standard Grant |
Program Manager: |
Sankar Basu
sabasu@nsf.gov (703)292-7843 CCF Division of Computing and Communication Foundations CSE Directorate for Computer and Information Science and Engineering |
Start Date: | August 1, 2018 |
End Date: | July 31, 2022 (Estimated) |
Total Intended Award Amount: | $450,000.00 |
Total Awarded Amount to Date: | $482,000.00 |
Funds Obligated to Date: |
FY 2019 = $16,000.00 FY 2020 = $16,000.00 |
History of Investigator: |
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Recipient Sponsored Research Office: |
200 UNIVERSTY OFC BUILDING RIVERSIDE CA US 92521-0001 (951)827-5535 |
Sponsor Congressional District: |
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Primary Place of Performance: |
900 University Ave Riverside CA US 92521-0001 |
Primary Place of
Performance Congressional District: |
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Unique Entity Identifier (UEI): |
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Parent UEI: |
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NSF Program(s): |
Special Projects - CCF, Software & Hardware Foundation |
Primary Program Source: |
01001920DB NSF RESEARCH & RELATED ACTIVIT 01002021DB NSF RESEARCH & RELATED ACTIVIT |
Program Reference Code(s): |
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Program Element Code(s): |
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Award Agency Code: | 4900 |
Fund Agency Code: | 4900 |
Assistance Listing Number(s): | 47.070 |
ABSTRACT
Electro-Migration (EM) has emerged as a major design constraint and reliability issue for nano-meter-scale integrated circuits (ICs) and emerging three-dimensional (3D) stacked ICs. Due to its importance, many advances have been made recently in EM modeling and fast numerical assessment techniques. However, those advanced EM models have not been fully exploited by existing EM-aware physical design and optimization methods to reduce and mitigate the overly conservative VLSI design practices. The new EM models can naturally consider wire topology and structure impacts on the EM failures of interconnect wires and recovery effects of EM aging process for the first time, thus opening new opportunities for EM optimization at physical design stages. Novel EM optimization techniques to be explored in this award will improve IC reliability amid continued aggressive transistor scaling and increasing power density. The research in this project will contribute significantly to the core knowledge and technologies of EM-aware physical design and optimization for nano-meter VLSI designs. This investigator will seek to recruit underrepresented minority students to further contribute to the diversity in U.S. science and technology workforce.
This project will develop advanced EM-aware physical optimization techniques and run-time EM mitigation techniques for traditional two-dimensional (2D) and emerging 3D stacked ICs in the nano-meter regime. First, the research will develop new EM-aware optimization techniques for power delivery networks of mainstream 2D and emerging 3D ICs based on the newly proposed EM immortality-check rules for general interconnect trees. The new optimization algorithms will also consider the EM-induced aging effects for targeted lifetime optimization using more accurate EM lifetime estimation methods. Second, the research will explore the run-time recovery effects of the EM aging process to extend the EM lifetime of the signal and power/ground (P/G) networks in 3D stacked ICs. The new optimization methods will, thus, help extend the lifetime of the 3D stacked ICs.
This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
PUBLICATIONS PRODUCED AS A RESULT OF THIS RESEARCH
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PROJECT OUTCOMES REPORT
Disclaimer
This Project Outcomes Report for the General Public is displayed verbatim as submitted by the Principal Investigator (PI) for this award. Any opinions, findings, and conclusions or recommendations expressed in this Report are those of the PI and do not necessarily reflect the views of the National Science Foundation; NSF has not approved or endorsed its content.
The objective of this project is to develop advanced EM-aware physical optimization techniques and run-time circuit-level EM mitigation techniques for traditional 2D and 3D stacked ICs in nanometer regime. Following are major tasks finished:
- EM-aware and EM-lifetime constrained power grid optimization considering multi-segment interconnect wires
- Dynamic reliability management for multi-core processor based on deep reinforcement Learning
- Long-term reliability management for multitasking GPGPUs
- Reliability based hardware trojan design based on physics-based electromigration models
- EMSpice: physics-based electromigration check using coupled electronic and stress simulation
- Reliable power grid network design framework considering EM immortalities for multi-segment wires
- An adaptive electromigration assessment algorithm for full-chip power/ground networks
- A fast semi-analytic approach for combined electromigration and thermomigration analysis for general multi-segment interconnects
- Run-time accuracy reconfigurable stochastic computing for dynamic reliability and power management
- Data-driven fast stress analysis for multi-segment interconnects
- Fast date-driven EM-induced IR drop prediction and localized fixing for on-chip power grid networks
- Electromigration immortality check considering Joule heating effect of multi-segment wires
- Fast electrostatic analysis for VLSI aging based on generative learning
- Fast electromigration stress analysis considering spatial Joule heating effects
- Fast date-driven EM-induced IR drop prediction and localized fixing for on-chip power grid networks
In the following, we list the three major contributions from this award:
In the following, we list the three major contributions from this award:
(1) EMSpice: physics-based electromigration check using coupled electronic and stress simulation
In this work, we proposed a novel full-chip EM simulation tool, called EMSpice simulator. The new method starts from first principles and simultaneously considers two major interplaying physics effects in EM failure process: the hydrostatic stress and electronic current/voltage in a power grid network. It then removes immortal interconnect wires by considering both nucleation phase immortality and incubation phase immortality for multi-segment interconnects. Experimental results on two practical processor chip designs show that the proposed coupled EM-IR drop analysis method can further reduce the overly conservative EM-aware power grid design as the number of the failed trees found by EMSpice simulator is up to 76.7% less than the Black's method and 66.7% less than a recently proposed full-chip EM analysis method respectively. [Sun, TDMR’20]
(2) Run-time accuracy reconfigurable stochastic computing for dynamic reliability and power management
In this work, we propose a novel accuracy-reconfigurable stochastic computing (ARSC) framework for dynamic reliability and power management. Different than the existing stochastic computing works, where the accuracy versus power/energy trade-off is carried out in. the design time, the new ARSC design can change accuracy or bit-width of the data in the run-time so that it can accommodate the long-term aging effects by slowing the system clock frequency at the cost of accuracy while maintaining the throughput of the computing. The proposed ARSC computing framework also allows much aggressive frequency scaling, which can lead to order of magnitude power savings compared to the traditional dynamic voltage and frequency scaling (DVFS) techniques. This technique is also demonstrated o the deep neural networks. Experimental results show that new ARSC DNN can sufficiently compensate the NBTI induced aging effects in 10 years with marginal classification accuracy loss while maintaining or even exceeding the pre-aging computing throughput. [Yu, CASES’20, Liu, ISQED’21]
(3) Fast date-driven EM-induced IR drop prediction and localized fixing for on-chip power grid networks
In this work, we proposed a fast full-chip electromigration (EM) aware IR drop constrained optimization framework, named {\it GridNetOpt}, for on-chip power grid networks accelerated by deep neural networks (DNN). Compared to the existing linear programming-based methods, the new method employs more flexible conjugate gradient-based optimization to size the wire width of the power grids. To mitigate the high cost of sensitivity calculation of the adjoint network using full-chip IR drop analysis at every iteration step, the sensitivity is computed via a trained conditional generative adversarial network (CGAN). Numerical results on a number of synthesized power grid benchmarks from ARM Cortex-M0 processor designs show that the proposed GridNetOpt can lead to at least an order of magnitude speedup over the conjugate gradient-based method using the traditional adjoint network method. [Zhou, ICCAD’20, Zhou, TCAD’21]
The PI's team has published 15 conference papers and 13 journal papers, one book, one book chapter. On the education side, five Ph.D. students who participated this project and received supports from this award, graduated from UCR including Dr. Zeyu Sun, Dr. Chase Cook, Dr. Han Zhou, Dr. Shaoyi Peng and and Dr. Sheriff Sadiqbatcha. All the Ph.D. students joined the US companies such as Intel Corporation, Cadence Design System, Synopsys Corporation etc.
In addition, several undergraduate student researchers, such as Karina Rowe (female, Latino), Winson Bi, Carson Welty, Cole Pivonka, Cindy Ho (female), Michael O?dea, Jonathan Clarke, Ally Thach (female) , Christian Campos (Latino), who were supported by REU funds of this award and other programs. They worked on various projects related to this project.
Last Modified: 01/29/2023
Modified by: Sheldon X Tan
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