| NSF Org: |
CNS Division Of Computer and Network Systems |
| Recipient: |
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| Initial Amendment Date: | August 21, 2014 |
| Latest Amendment Date: | July 23, 2019 |
| Award Number: | 1447237 |
| Award Instrument: | Standard Grant |
| Program Manager: |
Deepankar Medhi
dmedhi@nsf.gov (703)292-2935 CNS Division Of Computer and Network Systems CSE Directorate for Computer and Information Science and Engineering |
| Start Date: | October 1, 2014 |
| End Date: | September 30, 2020 (Estimated) |
| Total Intended Award Amount: | $237,210.00 |
| Total Awarded Amount to Date: | $284,170.00 |
| Funds Obligated to Date: |
FY 2018 = $46,960.00 |
| History of Investigator: |
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| Recipient Sponsored Research Office: |
401 WHITEHURST HALL STILLWATER OK US 74078-1031 (405)744-9995 |
| Sponsor Congressional District: |
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| Primary Place of Performance: |
322 EN STILWATER OK US 74078-5017 |
| Primary Place of
Performance Congressional District: |
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| Unique Entity Identifier (UEI): |
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| Parent UEI: |
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| NSF Program(s): |
CM - Cybermanufacturing System, Information Technology Researc, Networking Technology and Syst |
| Primary Program Source: |
01001819DB NSF RESEARCH & RELATED ACTIVIT |
| Program Reference Code(s): |
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| Program Element Code(s): |
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| Award Agency Code: | 4900 |
| Fund Agency Code: | 4900 |
| Assistance Listing Number(s): | 47.070 |
ABSTRACT
Manufacturing, and especially advanced manufacturing, is a key element of long-term U.S. prosperity and national security. Advanced manufacturing is at the threshold of the next major revolution catalyzed by advances in networking and Internet technologies. A new generation of agile and 'information based manufacturing' will involve collaborative use of cyber physical resources, simulation and other design/manufacturing tools. In this project, the manufacturing domain of interest is an emerging field called Micro Devices Assembly (MDA). MDA is an emerging advanced manufacturing field involving the manipulation and assembly of micron sized devices. Products in sensors, medical devices (such as heart monitors), surveillance devices and semiconductor manufacturing can be produced using such technologies.
In this project an ultra-fast network links distributed cyber physical resources which are used to accomplish the assembly of micron sized devices. The project has two major categories of tools involving the life cycle of micro devices assembly: cyber and physical. Cyber tools will be used to accomplish of assembly planning alternatives, analysis of candidate assembly plans, and Virtual Reality (VR) based simulation of assembly alternatives for target micro designs. Physical tools (or resources) will include manufacturing equipment (to assemble target micro designs), cameras and other related sensors (to guide in the complex assembly as well as to provide feedback during assembly). Such a cyber physical approach demonstrates the feasibility of using ultrafast networks and advanced networking technologies such as Software Defined Networking to support next generation collaborative frameworks for advanced manufacturing. In this system the high-definition multimedia streaming interfaces associated with the VR environment will enable partners to collaboratively propose, compare and refine assembly planning alternatives.
The project will use the advanced manufacturing test bed outlined in this project to support teaching of cyber physical concepts and manufacturing frameworks to engineering students at Oklahoma State University; some of the cyber tools developed will also be used subsequently as part of K-12 STEM learning activities involving students in Stillwater, Oklahoma City and the Muscogee (Creek) Nation schools in Oklahoma.
PUBLICATIONS PRODUCED AS A RESULT OF THIS RESEARCH
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PROJECT OUTCOMES REPORT
Disclaimer
This Project Outcomes Report for the General Public is displayed verbatim as submitted by the Principal Investigator (PI) for this award. Any opinions, findings, and conclusions or recommendations expressed in this Report are those of the PI and do not necessarily reflect the views of the National Science Foundation; NSF has not approved or endorsed its content.
This project focused on investigating research issues surrounding the design of an ultra-fast networking approach to support cyber-physical collaborative manufacturing. The manufacturing domain was the assembly of micron sized parts (referred to as micro devices assembly).
This project demonstrated the research findings by creating an advanced Internet-of-Things (IoT) based Cyber Physical Test bed including several cyber-physical components for the domain of micro assembly. This IoT Test bed is the first major IoT Test Bed created in the world. It is a unique Test Bed which emphasizes networking approaches based on Software Defined Networking (SDN) principles that support these cyber-physical interactions in an advanced manufacturing domain. The framework emphasizes an Information Centric perspective involving 3 core facets revolving around modeling, simulation and exchange of information that provide the foundation for these cyber-physical interactions.
A core part of this research was to explore the role of Virtual Reality (VR) based mediums as a vital link between cyber and physical worlds linked by next generation networking approaches. Prior to physical assembly, the various manufacturing options can be studied virtually by distributed teams of engineers in collaborative VR based environments. Such an approach enables different assembly alternatives to be studied, compared, modified and validated prior to physical assembly at a specific distributed location.
The cyber components of the IoT Test Bed for micro assembly created included the following:
1.Assembly Planning modules: based on Genetic Algorithms and Insertion Algorithm (multiple approaches were developed to support a Virtual Enterprise context where multiple partners can propose different ways for a given assembly problem)
2. Path Planning module: which was responsible to generate collision free 3D paths for the assembly planning modules
3. Creation of VR based assembly simulation environments (both non immersive and immersive) both with and without haptic interfaces to support study of assembly alternatives
The physical components of this Test Bed included:
Several robotic micro assembly work cells capable of assembling micron sized components
Cameras and controllers in these robotic work cells were used for monitoring and tracking of cyber-physical activities using an information centric tracking approach. The SDN networking techniques were used to support cyber-physical interactions among distributed cyber-physical components and resources.
More than ten papers were presented and/or published at leading IEEE, ACM and ASME conferences and journals. Some of the undergraduate minority students were involved in related research activities as part of supplemental activities conducted as Research Experiences for Undergraduates (REU) activities. Students were active in presenting refereed conference papers as well as co-authoring refereed journal papers.
Two of our technology based demonstrations received awards for our innovative demonstration of next generation networking techniques for distributed collaboration applications.
The 3D Virtual Reality based environments were scaled down and introduced as part of class lab modules in new courses in cyber-physical systems taught by Dr. Cecil at Oklahoma State University. Some of these 3D environments were also used to introduced minority and other K-12 students to STEM activities as part of a long running outreach program called Soaring Eagle. The overall goal of the Soaring Eagle program is to provide an early and exciting introduction to STEM through Virtual/Augmented/Mixed Reality environments.
Last Modified: 12/05/2020
Modified by: J. Cecil
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