NSF Org:	TI Translational Impacts
Recipient:
Initial Amendment Date:	January 11, 2006
Latest Amendment Date:	December 16, 2008
Award Number:	0548721
Award Instrument:	Standard Grant
Program Manager:	Cheryl F. Albus TI  Translational Impacts TIP  Directorate for Technology, Innovation, and Partnerships
Start Date:	January 15, 2006
End Date:	December 31, 2009 (Estimated)
Total Intended Award Amount:	$0.00
Total Awarded Amount to Date:	$716,504.00
Funds Obligated to Date:	FY 2006 = $468,233.00 FY 2008 = $248,271.00
History of Investigator:	Kenneth Johnson (Principal Investigator) kjohnson@solidica.com Dawn White (Former Principal Investigator) Raymond Opie (Former Principal Investigator)
Recipient Sponsored Research Office:	Solidica, Inc. 1194 Oak Valley Drive ANN ARBOR MI  US  48108-8942 (734)222-4680
Sponsor Congressional District:	06
Primary Place of Performance:	Clemson University 201 SIKES HALL CLEMSON SC  US  29634-0001
Primary Place of Performance Congressional District:	03
Unique Entity Identifier (UEI):
Parent UEI:
NSF Program(s):	STTR Phase II, IUCRC-Indust-Univ Coop Res Ctr
Primary Program Source:	app-0106  01000809DB NSF RESEARCH & RELATED ACTIVIT
Program Reference Code(s):	1049, 1052, 1401, 1467, 9102, 9146, MANU
Program Element Code(s):	159100, 576100
Award Agency Code:	4900
Fund Agency Code:	4900
Assistance Listing Number(s):	47.084

ABSTRACT

This Small Business Technology Transfer Research (STTR) Phase II project will complete the development of a support material for Ultrasonic Consolidation (UC) direct metal rapid prototyping and demonstrate the ability to build structures with high aspect ratios or overhanging features. This ability to apply UC to more complex shapes will enable engineers to design important parts more rapidly and less expensively. Basic iinformation developed on the mechanical properties of metals experiencing ultrasonic excitation will also be useful in other industrial processes, such as extrusion and ball milling.

The project will use the results from Phase I to identify a user friendly, cost effective, environmentally benign and easily removed support material, and demonstrate that its application can be integrated with the commercial UC platform.

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