NSF Org:	CMMI Division of Civil, Mechanical, and Manufacturing Innovation
Recipient:	THE PENNSYLVANIA STATE UNIVERSITY
Initial Amendment Date:	July 15, 2003
Latest Amendment Date:	July 15, 2003
Award Number:	0321099
Award Instrument:	Standard Grant
Program Manager:	Kevin Lyons CMMI  Division of Civil, Mechanical, and Manufacturing Innovation ENG  Directorate for Engineering
Start Date:	August 15, 2003
End Date:	July 31, 2004 (Estimated)
Total Intended Award Amount:	$371,000.00
Total Awarded Amount to Date:	$371,000.00
Funds Obligated to Date:	FY 2003 = $371,000.00
History of Investigator:	Srinivas Tadigadapa (Principal Investigator) Susan Trolier-McKinstry (Co-Principal Investigator) Jeffrey Zahn (Co-Principal Investigator)
Recipient Sponsored Research Office:	Pennsylvania State Univ University Park 201 OLD MAIN UNIVERSITY PARK PA  US  16802-1503 (814)865-1372
Sponsor Congressional District:	15
Primary Place of Performance:	Pennsylvania State Univ University Park 201 OLD MAIN UNIVERSITY PARK PA  US  16802-1503
Primary Place of Performance Congressional District:	15
Unique Entity Identifier (UEI):	NPM2J7MSCF61
Parent UEI:
NSF Program(s):	Major Research Instrumentation
Primary Program Source:	app-0103
Program Reference Code(s):	1788, 9146, MANU
Program Element Code(s):	118900
Award Agency Code:	4900
Fund Agency Code:	4900
Assistance Listing Number(s):	47.041

ABSTRACT

This Major Research Instrumentation (MRI) award provides funding for an inductively coupled plasma etching system consisting of three process modules: (i) advanced silicon etch module for high etch-rate, high aspect ratio etching of silicon; (ii) oxide etch module for high aspect ratio etching of quartz, silicon dioxide, and other ceramic materials; and (iii) a xenon difluoride vapor phase etching module for isotropic chemical etching of silicon with high selectivity. The instrument will be used by more than 25 research groups in 10 academic departments at Penn State University to conduct research in the areas of microfluidics, biochemical sensors, high-speed switches and nanoscale resonators for radio frequency applications, integration of high-performance piezoelectric and polymeric thin films into silicon microsystems and investigation into fundamental quantum mechanical effects at the nanoscale. It will also be used to develop undergraduate and graduate level laboratory courses in microfabrication techniques as part of a course curriculum in micro and nanosystems technology.

The proposed tool configuration will allow researchers at Penn State to develop novel sensors, actuators, and electronic systems for applications ranging from biomedical technology to homeland security. In addition to fostering interdisciplinary research, the tool will provide hands-on fabrication experience to students and will be instrumental in the creation of a workforce skilled in the areas of micro and nanoscale science and technology. The advanced etching capability with the uniquely developed etching processes will attract new research collaborations with industry and national laboratories to Penn State University. The etch tool will also impact the nano-camp and chip-camp programs currently offered for K-12 students on nanoscience and nanotechnology.

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