Skip to feedback

Award Abstract # 2230706
PIRE: US-Japan Partnership in Excitonic Soft Materials for Clean Energy

NSF Org: OISE
Office of International Science and Engineering
Recipient: UNIVERSITY OF VERMONT & STATE AGRICULTURAL COLLEGE
Initial Amendment Date: August 30, 2022
Latest Amendment Date: August 30, 2022
Award Number: 2230706
Award Instrument: Standard Grant
Program Manager: Maija Kukla
mkukla@nsf.gov
 (703)292-4940
OISE
 Office of International Science and Engineering
O/D
 Office Of The Director
Start Date: January 1, 2023
End Date: December 31, 2025 (Estimated)
Total Intended Award Amount: $1,499,583.00
Total Awarded Amount to Date: $1,499,583.00
Funds Obligated to Date: FY 2022 = $1,499,583.00
History of Investigator:
  • Matthew White (Principal Investigator)
    mwhite25@uvm.edu
  • Madalina Furis (Co-Principal Investigator)
  • Binbin Weng (Co-Principal Investigator)
  • Kyle Ikeda (Co-Principal Investigator)
  • David Punihaole (Co-Principal Investigator)
Recipient Sponsored Research Office: University of Vermont & State Agricultural College
85 S PROSPECT STREET
BURLINGTON
VT  US  05405-1704
(802)656-3660
Sponsor Congressional District: 00
Primary Place of Performance: University of Vermont & State Agricultural College
85 S PROSPECT ST
BURLINGTON
VT  US  05405-1704
Primary Place of Performance
Congressional District:
00
Unique Entity Identifier (UEI): Z94KLERAG5V9
Parent UEI:
NSF Program(s): PIRE- Prtnrshps Inter Res & Ed
Primary Program Source: 01002223DB NSF RESEARCH & RELATED ACTIVIT
Program Reference Code(s): 5921, 8396
Program Element Code(s): 774200
Award Agency Code: 4900
Fund Agency Code: 4900
Assistance Listing Number(s): 47.079

ABSTRACT

This project will establish a long-term interdisciplinary partnership between the University of Vermont, University of Oklahoma, Yamagata University, and Osaka University in Japan. It represents a concerted major interdisciplinary effort dedicated to harvesting, storing, and transferring energy in soft electronic materials for cost effective, high-throughput energy harvesting technologies, while training international scientists and promoting intercultural exchange. This partnership will bring the US-based participants unprecedented access to the remarkable soft-materials and optoelectronic device fabrication, characterization facilities, and extensive connections with semiconductor industries of tomorrow. The unique concentration of resources and knowhow is unprecedented and enables rapid progress for the future generation of soft electronic materials. The US-based team and Japan-based collaborators complementary expertise spans all aspects of synthesis, prototyping, thin-film growth, structural, electrical, and spectroscopic characterization. The ambitious goal to decarbonize the US electrical grid by 2035 and the entire energy sector by 2050 will require policy implementation, engineering infrastructure, and fundamental research to realize innovations beyond the state-of-the-art. The project explores fundamental energy conversion processes in soft materials, which offer potentially transformative form factors necessary to realize the 2050 targets.


Excitonic soft materials offer potentially transformative innovations towards high efficiency photovoltaics and alternative extremely-low-cost and highly scalable solar energy harvesting and flexible electronics technologies. The project will focus on specific goals aimed at enabling new energy production and sustainable energy consumption: a) enhance the coherent energy transfer beyond the naturally occurring 10 nm range which translates to slow diffusion and efficiency limitations b) leverage high-quality optical resonators, including gratings and photonic crystal nano-architectures, towards enabling excitons coupling to photonic states to form polaritons and further extending resonant energy transfer over long range, c) explore the hot carrier transfer at organic interfaces and d) tailor the intra and inter-molecular dipoles coupling to lattice vibrations towards minimizing the exciton binding energy and lowering the thermodynamic efficiency limit. It will lay a foundation for an international research hub with trans-disciplinary expertise in excitonic soft materials ranging from organic semiconductors to photosynthetic biopolymers guided by the societal goal of carbon-neutral energy sector by 2050. With a heavy emphasis on training generations of researchers in international research collaboration, language, and cultural competency, the project will expand the partnership for long-term progress towards this ambitious trans-national goal.

This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

PUBLICATIONS PRODUCED AS A RESULT OF THIS RESEARCH

Note:  When clicking on a Digital Object Identifier (DOI) number, you will be taken to an external site maintained by the publisher. Some full text articles may not yet be available without a charge during the embargo (administrative interval).

Some links on this page may take you to non-federal websites. Their policies may differ from this site.

Sultana, Hosna and Weng, Binbin "Implementing the Geometric Phase for Designing the Axially Asymmetric Metasurface Element" , 2024 https://doi.org/10.1364/CLEO_AT.2024.JTu2A.164 Citation Details
Sun, Lina and Yoshida, Tsukasa and Harada, Yuya and White, Matthew Schuette and Suzuri, Yoshiyuki "Amorphous dielectric metal-organic electron injection layer for efficient inverted organic light-emitting diodes" Organic Electronics , v.122 , 2023 https://doi.org/10.1016/j.orgel.2023.106878 Citation Details
Thakuri, Khadga_S and Cleary, Thomas and Allemeier, David and Kimura, Taisei and Aizawa, Naoya and Nakayama, Ken-ichi and Masuhara, Akito and White, Matthew_S "Defect engineering in organic semiconductor based metal-dielectric photonic crystals" Scientific Reports , v.14 , 2024 https://doi.org/10.1038/s41598-024-78971-6 Citation Details

Please report errors in award information by writing to: awardsearch@nsf.gov.

Print this page

Back to Top of page