December 13, 2012

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On the road to smaller, high-performance electronics, University of Illinois researchers have smoothed one speed bump by shrinking a key, yet notoriously large, element of integrated circuits. Three-dimensional, rolled-up inductors have a footprint more than 100 times smaller without sacrificing performance. The research team used industry-standard 2-D processing to pattern metal lines on a very thin dielectric film before rolling, creating a spiral inductor.Full Story

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University of Illinois at Urbana-Champaign

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