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Award Abstract # 0553649
Thermal Transport at Nanoscale Point and Line Constrictions and Interfaces

NSF Org: CBET
Division of Chemical, Bioengineering, Environmental, and Transport Systems
Recipient: UNIVERSITY OF TEXAS AT AUSTIN
Initial Amendment Date: September 1, 2006
Latest Amendment Date: August 27, 2007
Award Number: 0553649
Award Instrument: Standard Grant
Program Manager: Sumanta Acharya
sacharya@nsf.gov
 (703)292-4509
CBET
 Division of Chemical, Bioengineering, Environmental, and Transport Systems
ENG
 Directorate for Engineering
Start Date: September 15, 2006
End Date: August 31, 2010 (Estimated)
Total Intended Award Amount: $0.00
Total Awarded Amount to Date: $341,105.00
Funds Obligated to Date: FY 2006 = $323,105.00
FY 2007 = $18,000.00
History of Investigator:
  • Li Shi (Principal Investigator)
    lishi@mail.utexas.edu
  • John Howell (Co-Principal Investigator)
Recipient Sponsored Research Office: University of Texas at Austin
110 INNER CAMPUS DR
AUSTIN
TX  US  78712-1139
(512)471-6424
Sponsor Congressional District: 25
Primary Place of Performance: University of Texas at Austin
110 INNER CAMPUS DR
AUSTIN
TX  US  78712-1139
Primary Place of Performance
Congressional District:
25
Unique Entity Identifier (UEI): V6AFQPN18437
Parent UEI:
NSF Program(s): TTP-Thermal Transport Process,
INT'L RES & EDU IN ENGINEERING
Primary Program Source: app-0106 
app-0107 
Program Reference Code(s): 0000, 065E, 7237, 9179, OTHR, SMET
Program Element Code(s): 140600, 764100
Award Agency Code: 4900
Fund Agency Code: 4900
Assistance Listing Number(s): 47.041

ABSTRACT

ABSTRACT

National Science Foundation

Proposal Number CTS-0553649
Principal Investigator Shi, Li
Affiliation University of Texas at Austin
Proposal Title Thermal Transport at Nanoscale Point and Line Constrictions and Interfaces

Thermal transport at nanometer scale point and line constrictions and interfaces is a fundamental problem that is important for a number of technologies, such as scanning probe microscopy, novel thermal interface materials, and nanostructural electronic and thermoelectric devices. As of today, few measurement results of thermal resistances at nanoscale constrictions and interfaces are available. Moreover, although there have been extensive theoretical studies of contact thermal resistance between two solids, most of the existing analytical models have been developed for macro to micro scale contacts.
The research objective of this program is to measure and model thermal transport at nanoscale point and line constrictions and interfaces. Ultrahigh vacuum atomic force microscopy and nanofabricated structures will be employed to measure the thermal resistance of nanometer size point contacts, line interfaces, and Si constrictions. A molecular dynamics (MD) simulation method will be used to calculate the thermal resistance and temperature distribution at these nanoscale constrictions and interfaces. In addition to heat conduction, the calculation will investigate the influences of near- and far- field radiation transfer on the temperature distribution and thermal resistance. The results from the measurements and calculations will be correlated and used to verify and improve analytic models.
Intellectual Merit. The proposed research will obtain measurement data of thermal resistance at nanoscale constrictions and interfaces. The results from the measurements and simulations will fill in a knowledge gap and provide timely support for thermal design and thermal management of electronic and thermoelectric devices as well as new scanning probe microscopy and data storage methods.
Broader Impacts. The research will provide training opportunities for two graduate students and an undergraduate student participant in the NSF Research Experience for Undergraduates (REU) program. The research results will be used as case studies in two graduate courses and one new undergraduate technical elective course. The two investigators will give short lectures in the seminar series organized by local ASME student organization, and will actively participate in K-12 outreach activities sponsored by the university. The close collaboration with an industrial researcher will have mutual benefits for the education of the participating students and the transfer of knowledge gained from this study for industrial applications.

PUBLICATIONS PRODUCED AS A RESULT OF THIS RESEARCH

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(Showing: 1 - 10 of 15)
Cai, WW; Moore, AL; Zhu, YW; Li, XS; Chen, SS; Shi, L; Ruoff, RS "Thermal Transport in Suspended and Supported Monolayer Graphene Grown by Chemical Vapor Deposition" NANO LETTERS , v.10 , 2010 , p.1645 View record at Web of Science 10.1021/nl904196
Malcolm, NP; Heltzel, AJ; Sokolov, KV; Shi, L; Howell, JR "Simulation of a plasmonic tip-terminated scanning nanowire waveguide for molecular imaging" APPLIED PHYSICS LETTERS , v.93 , 2008 View record at Web of Science 10.1063/1.301381
Mavrokefalos, A; Moore, AL; Pettes, MT; Shi, L; Wang, W; Li, XG "Thermoelectric and structural characterizations of individual electrodeposited bismuth telluride nanowires" JOURNAL OF APPLIED PHYSICS , v.105 , 2009 View record at Web of Science 10.1063/1.313314
Moore, AL; Pettes, MT; Zhou, F; Shi, L "Thermal conductivity suppression in bismuth nanowires" JOURNAL OF APPLIED PHYSICS , v.106 , 2009 View record at Web of Science 10.1063/1.319165
Moore, AL; Saha, SK; Prasher, RS; Shi, L "Phonon backscattering and thermal conductivity suppression in sawtooth nanowires" APPLIED PHYSICS LETTERS , v.93 , 2008 View record at Web of Science 10.1063/1.297004
Moore, Arden L.;Cummings, Antonette T.;Jensen, Justin M.;Shi, Li;Koo, Joseph H.; "Thermal Conductivity Measurements of Nylon 11-Carbon Nanofiber Nanocomposites" Journal of Heat Transfer , v.131 , 2009 , p.091602-5 10.1115/1.3139110
Moore, Arden L.;Cummings, Antonette T.;Jensen, Justin M.;Shi, Li;Koo, Joseph H.; "Thermal Conductivity Measurements of Nylon 11-Carbon Nanofiber Nanocomposites" Journal of Heat Transfer , v.131 , 2009 , p.091602-5 10.1115/1.3139110
Moore, Arden L.;Pettes, Michael T.;Zhou, Feng;Shi, Li; "Thermal conductivity suppression in bismuth nanowires" Journal of Applied Physics , v.106 , 2009 , p.034310-7 10.1063/1.3191657
Moore, Arden L.;Saha, Sanjoy K.;Prasher, Ravi S.;Shi, Li; "Phonon backscattering and thermal conductivity suppression in sawtooth nanowires" Applied Physics Letters , v.93 , 2008 , p.083112-3 10.1063/1.2970044
Pettes, MT; Shi, L "Thermal and Structural Characterizations of Individual Single-, Double-, and Multi-Walled Carbon Nanotubes" ADVANCED FUNCTIONAL MATERIALS , v.19 , 2009 , p.3918 View record at Web of Science 10.1002/adfm.20090093
Saha, SK; Shi, L "Molecular dynamics simulation of thermal transport at a nanometer scale constriction in silicon" JOURNAL OF APPLIED PHYSICS , v.101 , 2007 View record at Web of Science 10.1063/1.271548
(Showing: 1 - 10 of 15)

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