News From the Field
Nano-sandwiching improves heat transfer, prevents overheating in nanoelectronics
September 12, 2018
This material is available primarily for archival purposes. Telephone numbers or other contact information may be out of date; please see current contact information at media contacts.Sandwiching 2D materials used in nanoelectronic devices between their 3D silicon bases and an ultrathin layer of aluminum oxide can significantly reduce the risk of component failure due to overheating, according to a new study published in the journal Advanced Materials, led by researchers at the University of Illinois at Chicago College of Engineering. Full Story
University of Illinois at Chicago
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