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Nano-sandwiching improves heat transfer, prevents overheating in nanoelectronics


September 12, 2018

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Sandwiching 2D materials used in nanoelectronic devices between their 3D silicon bases and an ultrathin layer of aluminum oxide can significantly reduce the risk of component failure due to overheating, according to a new study published in the journal Advanced Materials, led by researchers at the University of Illinois at Chicago College of Engineering. Full Story

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University of Illinois at Chicago

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