News From the Field
UCLA engineers develop world's most efficient semiconductor material for thermal management
July 18, 2018
This material is available primarily for archival purposes. Telephone numbers or other contact information may be out of date; please see current contact information at media contacts.Working to address "hotspots" in computer chips that degrade their performance, University of California, Los Angeles (UCLA), engineers have developed a new semiconductor material, defect-free boron arsenide, that is more effective at drawing and dissipating waste heat than any other known semiconductor or metal materials. Credit: Hu Research Lab/UCLA Samueli Full Story
University of California, Los Angeles Samueli School of Engineering
The U.S. National Science Foundation propels the nation forward by advancing fundamental research in all fields of science and engineering. NSF supports research and people by providing facilities, instruments and funding to support their ingenuity and sustain the U.S. as a global leader in research and innovation. With a fiscal year 2021 budget of $8.5 billion, NSF funds reach all 50 states through grants to nearly 2,000 colleges, universities and institutions. Each year, NSF receives more than 40,000 competitive proposals and makes about 11,000 new awards. Those awards include support for cooperative research with industry, Arctic and Antarctic research and operations, and U.S. participation in international scientific efforts.