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Microject cooling technology research
A researcher with the Microelectronics Thermal Management Program at the Georgia Tech 3D Systems Packaging Research Center (PRC) investigates the performance of microject cooling technology, developed there.
The 3D Systems PRC was established in 1994 as a National Science Foundation (NSF) Engineering Research Center. It has been the largest global research center dedicated to System-on-Package (SOP) and other emerging microsystems packaging technologies. Georgia Tech PRC is a nonprofit consortia funded by the NSF, the electronics industry and the state of Georgia. For more information, visit the center's website Here.
Credit: Courtesy Georgia Tech Center for Low Cost Electronics Packaging Research; photo by Stanley F. Leary
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