News From the Field
Heat-conducting polymer cools hot electronic devices at 200 degrees C
March 30, 2014
Researchers have developed a thermal interface material able to conduct heat 20 times better than other polymers. The new material could be used to draw heat away from electronic devices in servers, automobiles, high-brightness LEDs and certain mobile devices, allowing engineers to design electronic systems in different ways.
The National Science Foundation (NSF) is an independent federal agency that supports fundamental research and education across all fields of science and engineering. In fiscal year (FY) 2014, its budget is $7.2 billion. NSF funds reach all 50 states through grants to nearly 2,000 colleges, universities and other institutions. Each year, NSF receives about 50,000 competitive requests for funding, and makes about 11,500 new funding awards. NSF also awards about $593 million in professional and service contracts yearly.
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