News From the Field
UT-Arlington Engineers Working to Prevent Heat Buildup Within 3-D Integrated Circuits
December 19, 2012
In the effort to pile more power atop silicon chips, engineers at the University of Texas at Arlington have developed the equivalent of mini-skyscrapers in 3-D integrated circuits and encountered a new challenge: How to manage the heat created within the tiny devices.
University of Texas at Arlington
The National Science Foundation (NSF) is an independent federal agency that supports fundamental research and education across all fields of science and engineering. In fiscal year (FY) 2012, its budget was $7.0 billion. NSF funds reach all 50 states through grants to nearly 2,000 colleges, universities and other institutions. Each year, NSF receives about 50,000 competitive requests for funding, and makes about 11,500 new funding awards. NSF also awards about $593 million in professional and service contracts yearly.
Get News Updates by Email
Useful NSF Web Sites:
NSF Home Page: http://www.nsf.gov
NSF News: http://www.nsf.gov/news/
For the News Media: http://www.nsf.gov/news/newsroom.jsp
Science and Engineering Statistics: http://www.nsf.gov/statistics/
Awards Searches: http://www.nsf.gov/awardsearch/