News From the Field
UT-Arlington Engineers Working to Prevent Heat Buildup Within 3-D Integrated Circuits
December 19, 2012
In the effort to pile more power atop silicon chips, engineers at the University of Texas at Arlington have developed the equivalent of mini-skyscrapers in 3-D integrated circuits and encountered a new challenge: How to manage the heat created within the tiny devices.
University of Texas at Arlington
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