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Division of Civil, Mechanical and Manufacturing Innovation

Partnership for Advancing Technologies in Housing (PATH)

This program has been archived.


Name Email Phone Room
Jesus  M. de la Garza jgarza@nsf.gov (703) 292-7791  545 S  


Solicitation  05-547

Important Information for Proposers

A revised version of the NSF Proposal & Award Policies & Procedures Guide (PAPPG) (NSF 16-1), is effective for proposals submitted, or due, on or after January 25, 2016. Please be advised that, depending on the specified due date, the guidelines contained in NSF 16-1 may apply to proposals submitted in response to this funding opportunity.




The Directorate for Engineering of the National Science Foundation (NSF) announces a program solicitation in support of HUD’s Partnership for Advancing Technologies in Housing, or PATH. Whereas previous years’ solicitations have been open calls for a variety of research proposals, this year’s solicitation focuses on groundbreaking proposals in the five interdisciplinary areas designated to be the forefront of housing technology through the NSF-PATH Housing Research Agenda Workshop held at the University of Central Florida in February 2004. Please see the "Researchers" section of www.pathnet.org for a description of this workshop. These five interdisciplinary areas are:

  1. Construction Management and Production
  2. Structural Design and Materials
  3. Building Enclosures, Energy, and Indoor Air Quality
  4. Community and Economic Impacts of Housing Technology
  5. Systems Interactions and “Whole House” Approaches

PATH’s mission is to advance technology innovation in the homebuilding industry in order to improve housing value and performance. Its goals are to develop new housing R&D ventures; to coordinate non-commercial information and dissemination needs in homebuilding and construction; and to reduce the major institutional and policy barriers for innovation in the industry.

What Has Been Funded (Recent Awards Made Through This Program, with Abstracts)

Map of Recent Awards Made Through This Program

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