Division of Electrical, Communications and Cyber Systems
Communications, Circuits, and Sensing-Systems
ECCS Unsolicited Proposal Submission Windows
The submission window for unsolicited proposals in the ECCS Division is:
- October 1 - November 1 Annually
IMPORTANT NOTICE: Due to the recent government shutdown, ECCS will extend its Unsolicited Proposal Submission Deadline for EPAS, EPMD, and CCSS programs to Friday, November 8th, 2013.
Apply to PD 13-7564 as follows:
For full proposals submitted via FastLane:
standard Grant Proposal Guidelines apply.
For full proposals submitted via Grants.gov:
NSF Grants.gov Application Guide; A Guide for the Preparation and Submission of NSF Applications via Grants.gov Guidelines apply
(Note: The NSF Grants.gov Application Guide is available on the Grants.gov website and on the NSF website at:
Supplement Deadline Date: April 1, 2014
April 1, Annually Thereafter
Full Proposal Window: October 1, 2014
November 3, 2014
October 1 - November 1, Annually Thereafter
These submission windows do not apply to proposals for workshops, Early-concept Grants for Exploratory Research (EAGER), or Rapid Response Grants (RAPID) .
The Division deadline for Research Experiences for Undergraduates (REU) and Research Experience for Teachers (RET) Supplements is April 1st. Please note: The ECCS Division has established an $8,000.00 REU limit per student. Please contact your Program Director for further details.
The ECCS Division discourages multiple proposals by the same PI and/or Co-PI within the same submission window.
The Communications, Circuits, and Sensing-Systems (CCSS) program is intended to spur visionary systems-oriented activities in collaborative, multidisciplinary, and integrative research. CCSS supports systems research in hardware, signal processing techniques, and architectures to enable the next generation of cyber-physical systems (CPS) that leverage computation, communication, and algorithms integrated with physical domains. CCSS offers new challenges at all levels of systems integration to address future societal needs. CCSS supports innovative research and integrated educational activities in micro- and nano-systems, communications systems, and cyber-physical systems. The goal is to design, develop, and implement new complex and hybrid systems at all scales, including nano, micro, and macro, that lead to innovative engineering principles and solutions for a variety of application domains including, but not limited to, healthcare, medicine, environmental monitoring, communications, disaster mitigation, homeland security, transportation, manufacturing, energy, and smart buildings. CCSS also supports integration technologies at both intra-and inter-chip levels, new and advanced radio frequency (RF), millimeter wave and optical wireless and hybrid communications systems architectures, and sensing and imaging at terahertz (THz) frequencies.
Proposals for the CCSS program may involve collaborative research to capture the breadth of expertise needed for such multidisciplinary integrative activities. ECCS will consider supporting a limited number of small team proposals of three or more Investigators from different disciplines and/or universities.
Areas of interest include:
- Low Power, Low Noise, High Efficiency Communications, Sensing and Imaging Systems
- RF/Microwave and mm-Wave Circuits for Imaging and Sensing Systems
- Inter- and Intra-Chip Communications and Networking
- Wireless Integrated Sensors
- Submillimeter-Wave/Terahertz (THz) Imaging and Sensing Systems
- Integrated Circuit Design (Fault Tolerant, Self Test and Repair, Stochastic Design)
- Mixed Signal Circuits and Systems
- Interconnects and Packaging Techniques
Zhi (Gerry) Tian
- Cyber-Physical Systems (CPS)
- RF/Wireless, Optical, and Hybrid Communications and Networking
- Integrated Sensing, Communication, and Computational Systems
- Spectrum Access and Spectrum Sharing
- Signal Processing and Compressive Sampling
- Cyber Security
- Cognitive Radio
- Micro, Nano, and Bio Systems
- MEMS/NEMS Systems-on-a-Chip
- Sensors, Actuators, and Electronic Interfaces
- Diagnostic and Implantable Systems
- Chemical, Biological, and Physical Diagnostics
- Environmental Sensing and Monitoring
- Infrastructure Monitoring
- Micro Power and Energy Scavenging
- System-Level Fabrication, Packaging, and Assembly
What Has Been Funded (Recent Awards Made Through This Program, with Abstracts)
Map of Recent Awards Made Through This Program