Award Abstract # 0524263
Microfabricated Thermoacoustic Refrigerators for Electronics Cooling Applications

NSF Org: ECCS
Division of Electrical, Communications and Cyber Systems
Recipient: UNIVERSITY OF PITTSBURGH - OF THE COMMONWEALTH SYSTEM OF HIGHER EDUCATION
Initial Amendment Date: August 16, 2005
Latest Amendment Date: June 6, 2006
Award Number: 0524263
Award Instrument: Standard Grant
Program Manager: Rajinder P. Khosla
ECCS
 Division of Electrical, Communications and Cyber Systems
ENG
 Directorate for Engineering
Start Date: September 1, 2005
End Date: February 28, 2007 (Estimated)
Total Intended Award Amount: $0.00
Total Awarded Amount to Date: $95,000.00
Funds Obligated to Date: FY 2005 = $90,000.00
FY 2006 = $5,000.00
History of Investigator:
  • Jeffrey Vipperman (Principal Investigator)
    jsv@pitt.edu
  • Laura Schaefer (Co-Principal Investigator)
Recipient Sponsored Research Office: University of Pittsburgh
4200 FIFTH AVENUE
PITTSBURGH
PA  US  15260-0001
(412)624-7400
Sponsor Congressional District: 12
Primary Place of Performance: University of Pittsburgh
4200 FIFTH AVENUE
PITTSBURGH
PA  US  15260-0001
Primary Place of Performance
Congressional District:
12
Unique Entity Identifier (UEI): MKAGLD59JRL1
Parent UEI:
NSF Program(s): EPMD-ElectrnPhoton&MagnDevices
Primary Program Source: app-0105 
app-0106 
Program Reference Code(s): 0000, 9251, OTHR
Program Element Code(s): 151700
Award Agency Code: 4900
Fund Agency Code: 4900
Assistance Listing Number(s): 47.041

ABSTRACT

ECS-0524263
J. Vipperman, U of Pittsburgh

The objective of this research is to quantify the capabilities of microscale thermoacoustic refrigerators and establish the feasibility limits of using them to cool microelectronic devices. The approach is to form numerical models of small-scale thermoacoustic devices and associated heat exchangers such that parametric analyses can be performed and performance limits established. Various design parameters will be investigated and optimized, including geometry, operating pressure, gas mixture, and materials. Device elements will be fabricated and incorporated into existing thermoacoustic refrigerator models to permit experimental characterization and verification of the numerical models.

The proposed research is the direct result of the convergence of several important needs in manufacturing, science, education, and industry. Little or no work has been done to apply thermoacoustics to the issue of heat removal in electronics, which offers potential for a simple, efficient, and environmentally friendly method of cooling (no chlorofluorocarbons, hydrochlorofluorocarbons, or other harmful refrigerants). The proposed work identifies a novel technology that will allow manufacturers to reliably provide higher levels of heat dissipation from commercial and military electronics. The proposed technology can be applied in very diverse markets: almost any product that incorporates electronic components can be improved by the proposed research. It is anticipated that the device could be used for purposes other than cooling electronics as well.

PUBLICATIONS PRODUCED AS A RESULT OF THIS RESEARCH

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J. Peter Hensel, Randall S. Gemmen, Brian J. Hetzer, Jimmy D. Thornton, Jeffrey S. Vipperman, William W. Clark, Brian A. Bucci "Effects of Cell-to-Cell Fuel Mal-Distribution on Fuel Cell Performance" Journal of Power Sources , 2007

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