| NSF Org: |
EEC Division of Engineering Education and Centers |
| Recipient: |
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| Initial Amendment Date: | November 3, 1994 |
| Latest Amendment Date: | June 2, 2006 |
| Award Number: | 9402723 |
| Award Instrument: | Cooperative Agreement |
| Program Manager: |
Mary Poats
EEC Division of Engineering Education and Centers ENG Directorate for Engineering |
| Start Date: | November 1, 1994 |
| End Date: | October 31, 2006 (Estimated) |
| Total Intended Award Amount: | $20,440,192.00 |
| Total Awarded Amount to Date: | $29,606,168.00 |
| Funds Obligated to Date: |
FY 1996 = $2,003,841.00 FY 1997 = $2,092,427.00 FY 1998 = $2,506,146.00 FY 1999 = $2,805,432.00 FY 2000 = $2,850,000.00 FY 2001 = $5,080,125.00 FY 2002 = $2,119,844.00 FY 2003 = $3,699,969.00 FY 2004 = $2,412,000.00 FY 2005 = $1,666,040.00 FY 2006 = $50,000.00 |
| History of Investigator: |
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| Recipient Sponsored Research Office: |
926 DALNEY ST NW ATLANTA GA US 30318-6395 (404)894-4819 |
| Sponsor Congressional District: |
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| Primary Place of Performance: |
926 DALNEY ST NW ATLANTA GA US 30318-6395 |
| Primary Place of
Performance Congressional District: |
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| Unique Entity Identifier (UEI): |
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| Parent UEI: |
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| NSF Program(s): |
EngEd-Engineering Education, EWFD-Eng Workforce Development, ERC-Eng Research Centers, IUCRC-Indust-Univ Coop Res Ctr, WESTERN EUROPE PROGRAM |
| Primary Program Source: |
01000102DB NSF RESEARCH & RELATED ACTIVIT app-0102 app-0103 app-0104 app-0105 app-0106 app-0195 app-0196 app-0197 app-0198 app-0199 |
| Program Reference Code(s): |
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| Program Element Code(s): |
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| Award Agency Code: | 4900 |
| Fund Agency Code: | 4900 |
| Assistance Listing Number(s): | 47.041 |
ABSTRACT
9402723 TUMMALA This award establishes a new Engineering Research Center (ERC) at the Georgia Institute of Technology on Low-Cost Electronic Packaging. The vision of the ERC is to improve performance of electronic products significantly while simultaneously reducing size and cost. The objectives of the ERC are: (1) to carry-out research, development and prototype manufacturing in low-cost, high-performance, and portable electronic packages consistent with industry needs, (2) to transfer this knowledge to industry, and (3) to train future leaders by educating students, industrial personnel, and faculty from Georgia Institute of Technology and other institutions. The essential components of the ERC are research, partnerships with industry, education, and technology transfer. The research thrusts include: (1) package design and modeling, (2) low-cost micro-chip module (MCM) based on novel materials, processing, and large area planarization, (3) MCMs with integrated passive and active devices, (4) MCMs with integrated optoelectronic components, (5) novel interconnect materials and processing tools, (6) assembly, (7) testing including built-in self test for mixed-signal designs and fault location. (8) thermal management, and (9) large-area prototype manufacturing. The electronics industry is built on the following technology elements: semiconductor chips, electronic packages, power sources, displays, and the systems that are formed through integration. The United States leads in the design of computers, telecommunication system, and the use of electronics in most industrial and commercial applications. The United States trails in consumer electronics, and is increasingly dependent on non-domestic sources for electronic packages and production equipment. Electronic packaging is one of the most important strategic technologies in electronics. The ERC will have a major impact on education of students in this important topic. The Georgia Institute of Technology is among the largest producers of electrical, mechanical, and industrial engineering students in the United States. This ERC will expose undergraduate, graduate and post- graduate students to this area of high national economic importance. This award initiates the ERC with a 5-year cooperative agreement. ***
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